High-Quality Ni-Fe/Cu Multilayer Films with Antiferromagnetic Coupling
F. Stobiecki, J. Dubowik, T. Luciński, B. Szymański
Institute of Molecular Physics, Polish Academy of Sciences, Smoluchowskiego 17, 60-179 Poznań, Poland

H. Rohrmann, K. Röll
University of Kassel, FB Physik, 34109 Kassel, Germany

and M. Schmidt
Institute of Physics, A. Mickiewicz University, 60-780 Poznań, Poland
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We report structural and magnetic properties of Ni83Fe17/Cu multilayer films with various buffer layer and sublayer thicknesses of copper dCu and Permalloy dPy deposited by face-to-face sputtering. The following features prove a good quality of our films: a well-layered structure, complete antiferromagnetic coupling with a low coupling strength (2×10-5 J/m2 for dCu=1 nm and 10-6 J/m^2 for dCu=2.1 nm) and a low coercive field which make them attractive for possible applications as giant magnetoresistance sensors.
DOI: 10.12693/APhysPolA.91.277
PACS numbers: 76.50.+g, 75.50.Tt