Image Depth Profiling AES |
| T. Sekine and T. Sato Jeol Ltd., 3-1-2 Musashino, Akishima, Tokyo 196, Japan |
| Received: May 21, 1991; in revised form August 10, 1991 |
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| Image depth profiling AES incorporating an image processing technique has been developed. This method reconstructs a cross-sectional image from acquired 2-dimensional and/or 3-dimensional data. A binary image produced from a secondary electron image through image processing can be used to cut the area of interest for selected area analysis. In a failure analysis of a relay contact, we found by cross-sectional image observation that Fe and Ni permeate from pin holes in an Au layer covering a Fe-Ni alloy. A VTR head made of a polycrystalline ferrite core covered with a Sendust (Si-Al-Fe alloy) layer at the gap has been analyzed. Depth distributions of Al, 0, and Fe on different grains, and Al and O distributions near grain boundaries have been successfully reassembled from the 3-dimensional data. |
| DOI: 10.12693/APhysPolA.81.145 PACS numbers: 68.35.Dv |