Lithography-Based Surface Modification of Copper for Soldering Application

N.A.H.M. Mahayuddina, J.A. Wahaba, M.A.M. Salleha, M.F.M. Nazeria, P. Postawab, M. Nabiałekc, B. Jeżb, J. Garusd aCentre of Excellent Geopolymer and Green Technology (CeGeoGTech), Universiti Malaysia Perlis (UniMAP), Kompleks Pusat Pengajian Jejawi 3, Kawasan Perindustrian Jejawi, 02600, Arau, Perlis, Malaysia bDepartment of Technology and Automation, Faculty of Mechanical Engineering and Computer Science, Czestochowa University of Technology, al. Armii Krajowej 19c, 42-200 Częstochowa, Poland cDepartment of Physics, Faculty of Production Engineering and Materials Technology, Czestochowa University of Technology, al. Armii Krajowej 19, 42-200 Częstochowa, Poland dDepartment of Mechanics and Fundamentals of Machinery Design, Faculty of Mechanical Engineering and Computer Science, Częstochowa University of Technology, Dąbrowskiego 73, 42-201 Częstochowa, Poland

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This paper details the fabrication of dimple micro-texture on a copper substrate surface using the photolithography technique and the effect of dimple micro-textured surface on soldering. Dimple micro-textures with diameters of 100-500 μm were fabricated on a copper substrate. Then, the Sn-0.7Cu solder was reflowed onto the textured copper substrate. The solderability and wettability of Sn-0.7Cu solder were investigated using optical microscopy, the 3D surface profiler, and visual tests. The results showed that that the Sn-0.7Cu reflowed on textured substrate has a smaller spreading area than its non-textured counterpart. The dimple micro-texture resulted in a smaller spreading area and lower contact angles, indicating improved solderability.

DOI:10.12693/APhysPolA.142.74 topics: dimple micro-texture, photolithography, lead-free solder, wettability