Influence of Indium Content on the Wetting Behaviours of Sn3-xAg0.5CuxIn Alloy Systems
A. Erer, O. Uyanık
Karabük University, Science Faculty, Physics Department, 78050 Karabük, Turkey
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The purpose of this project is to investigate the wetting behaviors of Sn3-xAg0.5CuxIn (SAC-In) (x=0.5 wt%, 1 wt%, and 2 wt%) alloys at various temperatures (250°, 280°, and 310°) on copper (Cu) substrate in argon (Ar) atmosphere. The contact angles (θ) of alloys were gaged by sessile drop technique. The alloys' microstructures were examined by scanning electron microscopy/energy dispersive spectroscopy. Intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were observed at the interface of SAC-In/Cu. The results of wetting tests represent that the addition of 1 wt% In improves the wetting properties of the Sn-3 wt%Ag-0.5 wt%Cu (SAC305) alloy. The lowest θ was obtained as 35.55° for Sn-2 wt%Ag-0.5 wt%Cu-1 wt%In alloy at 310°.

DOI:10.12693/APhysPolA.135.766
topics: wetting, Pb-free solder alloys, IMC's, contact angle, sessile drop method