Diffusion Kinetics of Binary Ti-Ni Shape Memory Alloys |
| N. Ucara, S. Dogan a, A.F. Ozdemir a, S. Karakas b and A. Calik c
aPhysics Department, Art and Science Faculty, Suleyman Demirel University, Isparta, Turkey bMaterials Science and Engineering Department, Faculty of Engineering, Cankaya University, Ankara, Turkey cDepartment of Manufacturing Engineering, Technology Faculty, Suleyman Demirel University, Isparta, Turkey |
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| In this work, the boriding of binary Ti-Ni shape memory alloys was carried out in a solid medium at 1173 and 1273 K for 2, 4, and 8 h using the powder pack method with Ekabor-Ni powders. The boride layer was characterized by optical microscopy and scanning electron microscopy. The obtained results show that boride layer thickness increases with the increasing boriding temperature and time. Depending on temperature and boride layer thickness, the diffusion process is thermally activated, with the mean value of the activation energy being close to 67 kJ/mol. |
DOI: 10.12693/APhysPolA.132.524 topics: boriding, shape memory alloys, microhardness, boride layer, diffusion |