Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate
F. Omaça, D. Ozyurek a and M. Erer b
aKarabuk University, Technology Faculty, Manufacturing Eng., 78100 Karabuk, Turkey
bKarabuk University, Science Faculty of Physics, 78100 Karabuk, Turkey
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In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9°C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.

DOI: 10.12693/APhysPolA.131.165
PACS numbers: 81.05.Bx