Microstructure and Mechanical Properties of Lead-Free Solder Joints
P. Harcubaa and L. Trško b
aCharles University in Prague, Department of Physics of Materials, Prague, Czech Republic
bResearch Center of the University of Žilina, Žilina, Slovak Republic
Full Text PDF
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.

DOI: 10.12693/APhysPolA.128.750
PACS numbers: 06.60.Vz, 67.80.bf, 71.20.Lp