Microstructure and Mechanical Properties of Lead-Free Solder Joints |
| P. Harcubaa and L. Trško b
aCharles University in Prague, Department of Physics of Materials, Prague, Czech Republic bResearch Center of the University of Žilina, Žilina, Slovak Republic |
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| In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces. |
DOI: 10.12693/APhysPolA.128.750 PACS numbers: 06.60.Vz, 67.80.bf, 71.20.Lp |