ACTA

Preparation and Characterization of Copper Powders with Sn Coating by the Electroless Plating

M. Uysal^a, T. Cetinkaya^a, H. Gul^b, M. Kartal^a, H. Algul^a, M. Tokur^a, A. Alp^a, H. Akbulut^a
^aSakarya University Engineering Faculty, Department of Metallurgical & Materials Engineering, Sakarya
^bDüzce University Gumusova Vocational School Department of Metallurgical 81850 Duzce

Full Text PDF

In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on the surface of copper powders was varied by using different concentrations of SnSO₄ in the plating bath. The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites. X-ray diffraction (XRD) analysis was performed to investigate the structure of the Sn-Cu composite powders. The electrochemical performance of Sn-Cu nanocomposites was studied by charge/discharge tests.

DOI: 10.12693/APhysPolA.127.1106
PACS numbers: 82.47.Aa; 81.15.-z; 73.61.At