Effects of Substrate Temperature on Structural Properties of Tin Oxide Films Produced by Plasma Oxidation after Thermal Evaporation

M. Alaf, M.O. Guler, D. Gultekin and H. Akbulut Sakarya University, Dept. of Metallurgical & Materials Engineering, 54187, Sakarya, Turkey

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In this study, tin film was thermally evaporated onto a stainless steel substrate in an argon atmosphere. The tin films were then subjected to a DC plasma oxidation process using an oxygen/argon gas mixture. Three different substrate temperatures (100°C, 150°C, and 200°C) and three different oxygen partial pressures (12.5%, 25%, and 50%) were used to investigate the physical and microstructural properties of the films. The surface properties were studied by scanning electron microscopy, X-ray diffraction, atomic force microscopy and a four-point probe electrical resistivity measurement. The grain size and texture coefficient of the tin oxide films were calculated. Both SnO and SnO2 films with grain sizes of 13-43 nm were produced, depending on the oxygen partial pressure. SnO films have flower- and flake-like nanostructures, and SnO2 films have grape-like structures with nanograins. The resistivity values for the SnO2 phase were found to be as low as 10-5 Ω cm and were observed to decrease with increasing substrate temperature.

DOI: 10.12693/APhysPolA.123.326 PACS numbers: 64.70.fm, 73.61.At, 81.16.Pr